3D Integration for VLSI Systems
3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by an impressive selection of experts. This is a great reference source for everyone following this promising technology.
Prof. L. Rafael Reif, Provost and Maseeh Professor of Emerging Technology, MIT, USA
- Format: Hardcover
- ISBN: 9789814303811
- Subject: Electronic Materials
- Published: September 2011
- Pages: 378
USD $160.00
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