Self-Organized 3D Integrated Optical Interconnects View Front MatterView Back Matter

Self-Organized 3D Integrated Optical Interconnects

by Tetsuzo Yoshimura

“This is an outstanding book on self-organized 3D integrated optical interconnects tailored for high-performance chip- and board-level photonic communications. The book outlines fundamental and practical challenges of photonic links at these distances and discusses strategies for continued performance and cost scaling. It covers key aspects of the heterogeneously integrated photonic technologies pioneered by the author, who is a leading expert in this area. The presented approaches and in-depth discussions will stimulate further research and development activities in a variety of related topics. The book is designed to meet diverse needs of scientists, engineers, and students in the fields of integrated photonics and solar energy conversion systems. It is thereby a significant and timely contribution that will stand the test of time.”

Dr. Tian Gu, Massachusetts Institute of Technology, USA
  • Format: Hardcover
  • ISBN: 9789814877046
  • Subject: Photonics and Lasers
  • Published: March 2021
  • Pages: 380

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules.

This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.